Predicts and corrects wafer warpage during EUV lithography using biharmonic FEM (0.028% error), iterative learning control (ILC), and a ROM surrogate. 94.4% warpage reduction. 11,000 deterministic FEM solves across 5 materials. FEM accuracy 0.028% vs Timoshenko analytical. 5 utility patents filed (280 claims).

Rectangular substrates are immune to azimuthal stiffness artifacts (0.000% effect, 30 NLGEOM FEM cases). Kirchhoff von Karman nonlinear plate solver, AI compiler (R² = 0.89±0.02 (5-fold CV; training R²=0.9977 on 3,508 CLPT samples)), and Bayesian optimization achieving 4.53 um best warpage across 14 real FEM task IDs.

Self-pumping cooling using solutal Marangoni effect in binary fluid mixtures. Simulation design envelope: 68.9C junction at 133 W/cm² for NVIDIA B200 (1000W/750mm²). No mechanical pump needed -- surface-tension gradients drive flow at 0.15-0.24 m/s. 100/100 Monte Carlo stable. CHF enhancement 1.6-2.4x flow-to-flow vs Novec 7100. Zero-G verified. Experimental validation pending.

Four photonic inventions: (1) Glass Firewall with 40-55 dB practical RF isolation at 100 GHz via TMM, (2) Zernike-optimized substrates with R²=0.97 predictability, (3) Low-index optical lattice with 25% phase-velocity speedup, (4) Smart substrates with 70% weight reduction. CLI (9 commands), REST API (14 endpoints), Python SDK.

Three inventions: (1) Janus ligands for rare-earth extraction -- 730 verified structures, 58 DFT calculations, 20-40% CapEx reduction (Kremser validated), (2) Fluorocatchers for PFAS remediation -- -121 kJ/mol binding energy, (3) Steric sieve membranes -- ~10x Li+/Na+ selectivity (10.42x, 10 ns/window PMF). All backed by DFT (CP2K) and MD (GROMACS) on A100 GPUs.

Janus Ligand vs P507: 11,000 separation factor vs 2.5 industry standard. Single-stage purification replacing 10-stage solvent extraction. 58 forensically-verified DFT calculations, 100% convergence. ML pipeline with Ridge (R²=0.873, caveat: small sample, dominated by metal identity feature), GBR (0.915), RF (0.888).

HEADLINE: Gyroid LLZO passes Monroe-Newman dendrite suppression at all porosities up to 60% (1.8x threshold at 60%). The only SSB architecture that maintains mechanical dendrite blocking while maximizing ionic conductivity. Phase-field dendrite simulations are qualitative only (Allen-Cahn model artifact; Cahn-Hilliard is the correct model). Four pillars: Stiffness Trap, Steric Sieve (Born-model selectivity at 0.7nm), Internal Tensegrity (6.7 GPa bulk modulus), Smart Fuse (19 Pareto configs, 3.05 mS/cm post-rupture). Ionic conductivity 0.112 mS/cm (reconciled).

The ONLY glass-specific PDK in existence. Automated TGV interposer design platform with 22 solvers. 8 patent families (89 claims) all reduced to practice. 2-4x cheaper than silicon CoWoS with 605 analytically screened design points (50±2 Ohm via BEM; internal consistency validated, HFSS validation pending). Spec-in, GDSII-out compiler demo in <1s. ML surrogate being retrained (was R²=0.537). 528-test pytest suite validates thermal-structural-RF co-optimization. Full CLI (6 commands) and REST API.

Automated EM isolation synthesis for multi-die chiplet packages. Via fences, mushroom EBG, fractal EBG, metasurfaces, and topology-optimized inverse design. JAX-accelerated 2D FDTD with CPML absorbing boundaries. Adjoint r=1.0, 27 dB topology optimization. 22-39 dB frequency-dependent isolation across 1 GHz to 77 GHz.

Full hybrid bonding physics chain: GDS layout to CMP topography to contact mechanics (p_void fixed via JKR Maugis 1992) to void formation to thermal stress to Cu2O delamination risk to Monte Carlo yield. Spectral FFT O(N log N) solver. All 3 patent claims now implemented: neural surrogate (experimental MLP), gradient-compensated fill, multi-objective optimizer. KLA Archer integration. TSMC deployment kit (3 die layouts). Note: correlation_length parameter requires fab calibration.